In recent years, " Chinese Lack of Chips" caused social concerns . According to statistics, the chip imports are of nearly $ 200 billion . Chips are mobile phones, computers , cars, household appliances and other products, " brain" , and in 80% of the integrated circuit chip-based demand dependent on imports. If the " brain" of the control is not in our hands, will save big huge risk. For this reason, solve the " Chinese air core " of the problem is even more urgent.The current China 's IC industry is facing many trials : a large gap between First and international level. Moore , though close to the limit , but still pushing process technology upgrade , industry experts predict process technology will be developed to 7nm ~ 5nm. Current international advanced technology by the end of this year will pilot 14nm, and 28nm process still try to run the country , with our level of technology gap with foreign countries more than two generations . The second is the development of advanced technology required a huge investment of billions of dollars at every turn , billions of dollars of investment, the domestic enterprises is a huge challenge. Third -end process technology era, foreign giants will Together, domestic enterprises will be smaller living space.To solve the " Chinese air core " of the problem , we must solve the " chip manufacturing " problem. Chip manufacturing in general, including foundry , assembly and test links. Especially in the back-end packaging and testing aspects , the aspects of technology if not achieved, then the chip will not be produced.At present, the domestic packaging and testing industry collaborative innovation industrial chain , to solve the " Chinese air core " of the problem is significant.First, application- driven, downstream to become a community of interests , change the " trading relationship " between the upstream and downstream enterprises to truly create a " strategic partnership " that can Jiaodi each other , so as to avoid detours.Second, leading enterprises to take the lead, forming a chain Corps combat. For example , the leading packaging companies , led businesses to encourage upstream materials and equipment research and development equipment , packaging companies to encourage downstream priority domestic packaging equipment developed to promote high-end manufacturing equipment in China.Third, the integration of resources , to achieve seamless connectivity. With Moore's close to the limit , system in package (3D package ) under ultra- Moore is the integrated circuit industry has brought a new focus. For this new technique, both domestic and foreign are standing on the same starting line . Domestic packaging and testing industry may turn to overtake realized with 3D packaging . IC packaging and testing industry With this excellent opportunity to set up R & D consortium TSV integration of talent and resources to jointly carry out the original technology innovation, development and integration of technology products imported technology, the various aspects connected seamlessly . IC packaging and testing industry hopes to " go beyond the local " corner overtaking achieve .