According to final results of the International Research and Consulting firm Gartner , in 2013 the total worldwide semiconductor manufacturing equipment spending is $ 33.8 billion , representing a decline of 11.5% in 2012 . Wafer-level manufacturing equipment needs to outperform the market , especially lithography (lithography) and related processes for the strong , the other hand is the back-end manufacturing performance is far better than average. Klaus-Dieter Rinnen vice president at Gartner , said : "In this context , capital expenditures paled and concentrated in a few leading manufacturers of memory -related expenses in the year in which the recovery is still not enough to counterbalance the decline in equipment sales despite . Fab investment increased, but they form a logically related expenses offset by force. thus making manufacturing equipment sales show slow and linear growth season , even an explosion in the fourth quarter sales are not enough to reverse the second consecutive year of negative growth. "Comparative advantages Applied Materials (Applied Materials) with deposition (deposition) and etching (etch) to hold the top spot in the field (see table below ) . And ASML is relying on the comparative advantages of lithography aspects ( although extreme ultraviolet field performance is limited ) remained at second. Colin R & D (Lam Research) because of the strong performance of the etching and deposition of promotion to the third. Tokyo Power Branch Chong (Tokyo Electron) is headquartered in Japan , and other businesses , like the Japanese yen by the sharp drop in the dollar exchange rate impact , and customer purchasing patterns unfavorable factors. Rinnen said: " It is worth noting that the market share of the top ten vendors to further grow to 70 % while in 2012 , 68% of the top five manufacturers that accounted for nearly 57% of the total market , growth of five percentage points over last year . these giant symbol of progress in the competition among small factory defeat also means equipment market increasingly dependent on a handful of vendors . "In 2013 , wafer-level manufacturing outperformed the market in the dry etching , lithography , process automation, and sedimentary aspects appear to be relatively strong. Expenditures selective focus on upgrading and purchasing the latest technology , production capacity rarely . Logic expenditure is focused on 20 -nm / 14 nm process preparation. Only a small number of sub- areas of growth , most notably the field of lithography stepper (stepper), the non -tube (non tube) chemical vapor deposition (CVD), conductor etch (conductor etch), rapid thermal and thermal furnace, as well as some process control areas ( such as wafer inspection , defect review and classification ) .In the back-end process areas , all major categories were highly significant recession. The fourth quarter of 2013 is particularly slow , because the main semiconductor packaging and test services (SATS) manufacturers because the market uncertainty and delayed orders.