Automotive electronics development momentum heyday . Europe and Asia wisdom depot off cars, electric cars (EV) design trends , semiconductor manufacturers have been attracting full lineup of extended vehicle components ; Which, by the Chinese mainland Compass and the European Galileo (Galileo) operators to switch to new business opportunities arising from the operation , and more stimulate multi- satellite global navigation satellite system (GNSS) demand for rapid warming , prompting chip manufacturers have extended the relevant product lineup .STMicroelectronics (ST) in the Greater China region in South -cum automotive products business group (APG) Moore , director of markets and applications Li (Edoardo Merli) said , GNSS positioning chips to catch a networked automotive design trends , the volume in the global auto market is rapidly surge in vehicle kinetic energy has become an important electronic semiconductor factory revenue growth . With mainland China Beidou satellite in late 2013 commercial , and the EU Galileo satellite also plans to expand in 2014 ~ 2015 rpm supplier , depot also began to seek support new satellite system solutions GNSS chip is expected to again set off a wave of procurement opportunities .In fact, most of the existing GNSS chip only supports the North American global positioning satellite (GPS) and the Russian GLONASS, and this signal coverage of the two satellite systems in Europe and the Asia-Pacific region is insufficient, then the impact on the positioning accuracy of land vehicle navigation system . As a result, the European mainland China 's own satellites and enable the local depot , and even telecommunications providers in terms of significance , it will help to improve the navigation relevant industry experience , and is expected to introduce more machine-to- machine (M2M) applications and location-based services (LBS), and create new business opportunities. Optimistic about the potential of multi-satellite GNSS market , Broadcom (Broadcom) was first published in China by the end of 2013 compatible Compass , North America global positioning satellite (GPS), the European Galileo (Galileo), the Russian GLONASS and Japanese Quasi-Zenith Satellite System (QZSS) of GNSS receivers single chip. Let Broadcom ahead of us , STMicroelectronics also early in 2014 to follow up the launch of the new multi-satellite GNSS chips - TeseoIII, and actively expand the card bit . Moore Li stressed that the chip can simultaneously track in addition to the countries outside the satellite signals , combined with the exclusive automotive dead reckoning (Dead Reckoning) and sensor technology to provide assisted navigation solutions in the GNSS reception is poor , the system locates accuracy pushed to a higher level .STMicroelectronics APG car audio and telematics processor marketing manager Fabrice Guerrier supplement , Teseo III by the European Space Agency and has been field-tested Chinese mainland official units , and has started sending samples respectively ; its integrated radio frequency (RF), digital controller and flash memory , a substantial increase in the degree of integration of the advantages of peripheral components , and will help the depot level (Tier1) suppliers to reduce system bill of materials (BOM) cost , taking into account the performance. In addition to Broadcom and STMicroelectronics outside , including Qualcomm (Qualcomm), MediaTek , British businessmen Cambridge wireless semiconductor (CSR) and mainland China IC design industry is also actively instigated the multi-satellite GNSS chip design case is expected this year in succession enshrined in new products shape.