The semiconductor structure of past development of the continent is not perfect, the overall IC industry appeared behind the two features: (1) the development of standards behind a large number of low-end products export, import large quantities of high-end products. (2) the structure of the "first light foot heavy" upstream design, manufacturing low percentage, high proportion of the downstream packaging industry. IC packaging and testing industry in mainland China accounted for 45%, IC manufacturing sector accounted for 30%, IC design industry accounted for 25%. Although the IC packaging and testing industry the largest share, but higher-order packaging and testing technology mostly rests in the hands of international manufacturers, in order to improve the plight of this industry, in June 2014, the Chinese government formally approved by the State Council, "Promoting the National Integrated Circuit Industry Development Platform "is expected founded 120 billion yuan (about 600 billion NT dollars) investment fund to support China's semiconductor industry. Taiwan and mainland China's semiconductor industry competition, the official flames of war. Foreign manufacturers also smell-related threats, Qualcomm antitrust investigation after receiving Chinese government initiated immediately announced 28 nanometer (nm) to the mainland part of the mobile phone chip production foundry SMIC, a good show to the Chinese government . Chinese domestic market is large, with the weight of the right to speak, but also actively use weapons continent. Continental ZTE independently developed LTE multimode chip platform, through the mobile authentication, breaking the monopoly of foreign chip plant long-term position. They show Chinese semiconductor accelerate its development through import substitution policies the introduction of foreign advanced technology, wafer autonomy. Taiwan's semiconductor industry is mainly the impact from the mainland has been in the development of IC packaging and testing industry. In order to meet future industrial construction plan, Continental SMIC and has a joint venture in Jiangsu Changjiang Electronics can produce 12-inch 50k chip bump processing (Bumping) plant to jointly build local IC manufacturing chain. In addition, Jiangsu Changjiang Electronics possible overseas acquisitions, bought the beta foundry fourth world market share of 6.9% of IC packaging and testing plant in Singapore, STATS ChipPAC (STATS Chip PAC); Jiangsu Changjiang Electronics plus STATS ChipPAC, market share can be reached 9.8%, will officially become the world's third largest IC packaging and testing plant. In the foundry parts, although the continent's largest foundry SMIC market share of only 4.6%, not enough to pose a threat to Taiwan's industry, but SMIC in helping Chinese and foreign policy support, the expected five years market share will grow to about 9 percent, to enter the world top three. Faced with the strong impact of the rise of China's semiconductor industry, Taiwan's semiconductor industry, although a strong cumulative case in the past, but should also be wary of, and actively develop blue ocean market, strengthen their own niche. For example, although in the second Five-Year Plan continent, and actively support the development of micro-electromechanical systems (MEMS), but the MEMS market is mainly dominated by European and American IDM and Fabless factory, manufacturers high concentration of Chinese market share is still very low, and wearable rise of devices and the Internet of Things, MEMS-related demand is expected to continue to rise, how actively cut MENS supply chain, will be an important topic of Taiwan's semiconductor industry.