MIC estimates that this year China mainland IC packaging and testing industry output will reach 18 billion U.S. dollars, compared with 2013 growth of 13%. IC packaging and testing plant in Taiwan for mainland China to accelerate advanced process layout, high-order packages for local orders. Industrial Information Institute for Information Industry (MIC) said the increase in integrated device manufacturers benefit from foreign manufacturers (IDM) packaging and testing requirements, government financial subsidies in China IC design industry, driven by the rapid growth of the Chinese mainland IC packaging and testing industry. MIC pointed out that mainland China IC packaging and testing industry is mainly dominated by foreign investment and joint ventures, Chinese IC packaging and testing companies, including trendy Jiangsu Changjiang Electronics Technology Group, Nantong Freshwater microelectronics, Tianshui Huatian so on. Observation of Taiwan and mainland China competing in IC packaging and testing industry trend, MIC pointed out that Taiwan's IC packaging factory is currently manufacturing process technology is still a substantial lead, but with the Chinese mainland itself foundry process improvement, packaging and testing plant in Taiwan in mainland China has accelerated advanced process layout, through high-order packages for local orders, avoid subsequent Chinese mainland manufacturers to compete. In Taiwan manufacturers part, MIC said, ASE (2311) to increase investment in mainland China Shanghai Jinqiao plant system in package (SiP) packaging through its USI, SPIL (2325) Suzhou factory amplified flip chip size package (FC-CSP ) packaging capacity. In the Chinese mainland part, MIC pointed out that higher-order active layout Jiangsu Changjiang Electronics package, a joint venture with SMIC 12-inch bump (Bumping) wafer capacity.