According to the Japan Electronics Circuit Association (JapanElectronicsPackagingCircuitsAssociation; JPCA) released the latest statistics show that (in the number of employees in enterprises with more than 50 people for statistical object), in July 2014 the Japanese printed circuit board (PCB; hard board + soft board + module board) production compared to the same month last year grew 1.3% to 1.171 million square meters, the seventh consecutive month to show growth; yield fell 2.9% to 41.899 billion yen, the sixth consecutive month showing decline.The kind of view, July Japan hard board (RigidPCB) yield compared with the same month last year grew 1.9 percent to 929,000 square meters, showing continuous growth in the first 10 months; yield fell 5.3% to 27.74 billion yen, the third consecutive month showing decline. Soft board (FlexiblePCB) production decline 6.1 percent to 186,000 square meters, for three months for the first two degrees a downward; yield fell 20.0 percent to 4.797 billion yen, the sixth consecutive month showing decline. Module substrate (ModuleSubstrates) yields surge 19.1% to 56,000 square meters, the second consecutive month to show growth; yield growth of 19.1 percent to 9.362 billion yen, showing continuous growth in the first three months. Cumulative Japanese PCB production grew 5.5 percent from a year earlier to 7.726 million square meters in 2014 January-July period, yield declined 1.5 percent to 2,732.77 one hundred million yen. Among them, the Japanese hard board production from January to July period grew 7.5 percent from a year earlier to 6.253 million square meters, the yield fell 0.9 percent to 1,857.92 one hundred million yen; soft board production fell 2.8 percent to 1.147 million square meters, yields decline 10.1 percent to 30.334 billion yen; module substrate yield was unchanged at the level of the same period last year was 32.6 million square meters, yield growth of 1.8% to 57.151 billion yen.