Hybrid integrated circuits are made ​​from semiconductor integrated technology and thin (thick) membrane technology combined with integrated circuits. Relative to the monolithic integrated circuit, it is designed to be flexible, easy to process, easy to many varieties of small batch production; and a wide range of device parameters, high accuracy, good stability and can withstand higher voltage and higher power, so the market prospect is broad. Champoux consulting industry analyst pointed out: hybrid integrated circuit is a miniaturized, high performance and high reliability interconnect packaging means, plays a very important role in electronic miniaturization process. Currently, the industry is in the direction of the system into a small package continuous development goals. After years of development, China in the field of hybrid integrated circuits already have a certain amount of research, development and production capacity, products have been in the aviation, aerospace, ships, weapons, communications, radar, electronic warfare and power electronics, automotive electronics, medical electronics and other consumer electronics products are widely used. Since the hybrid integrated circuit technology is a secondary means of integration, only domestic semiconductor integrated circuit industry, materials industry and the equipment industry to obtain considerable progress, in order to promote the development of hybrid integrated circuits. Hybrid integrated circuits, is moving into the international system-on-chip, micro sensors, micro actuators and peripheral film passive components integrated together, set microelectronics, photonics technology, mems (MEMS) and nanotechnology in one system in Package (sop) phase. Carrier tape with a multilayer wiring and welding technology, the monolithic semiconductor integrated circuit assembly and interconnection, to achieve the second integrated production complex multi-functional, high-density large-scale hybrid integrated circuits. In addition, the interconnect substrate for assembly with a leadless miniature sheet-like element, the device, in order to reduce the price of the electronic device and to improve its performance. Therefore, in the coming period related businesses can focus on these areas.