Electronic devices that require high performance, high speed and thin, light weight, and as a multi-disciplinary high-end electronic equipment industry --PCB is the most critical technology. PCB products, whether rigid, flexible, rigid - flex plywood, as well as for the module substrate IC package substrate for high-end electronic equipment to make a great contribution. PCB industry occupies an important position in the electronic interconnect technologies. On the current PCB technology trends, there are five points. One along the high-density interconnect technology (HDI) go on the road, two component potting technology has strong vitality. Three, PCB in materials development to the next level. Whether it is a rigid or flexible PCB PCB material, as the global lead-free electronic products, must make these materials require higher heat resistance, so the new high Tg, low coefficient of thermal expansion, low dielectric constant and dielectric loss tangent of good material emerging. Fourth, the photoelectric PCB prospects. It uses optical layer and the circuit layer transmission signal, this new technology is the key to the optical path layer (optical waveguide layer) manufacturing. It is an organic polymer, the use of lithographic photocopiers, laser ablation, reactive ion etching or the like is formed. Currently the technology in Japan, the United States has industrialization. Fifth, the manufacturing process to be updated to introduce advanced equipment.