ITRI IEKITIS estimates that this year the output value of Taiwan's IC packaging and testing can be up to NT $ 476.3 billion yuan, compared with 453.9 billion yuan last year ,a growth of 4.9 percent. This year Taiwan's IC packaging industry output will reach 334 billion yuan, compared with 316 billion yuan last year ,a growth of 5.7 percent , IC testing industry output will reach 142.3 billion yuan, compared with growth of 3.2 percent last year, 137.9 billion yuan. ITRI IEKITIS pointed out that last year, Taiwan's IC packaging and testing industry by smart phones and tablet PCs to push up demand, growing 10.4% over the previous year 411 billion yuan. Looking ahead, the institute IEKITIS estimates that this year will continue the handheld device and the Internet of Things (IoT) growth momentum. Smart phones and tablet PCs are still pushing up the IC packaging and testing owners want growth momentum. ITRI IEKITIS plan, said this year is the 4GLTE mobile phone chip off a year, among the higher-order chip and flip chip packaging and testing capacity, wafer bumping will follow tight, and fan-out wafer level packaging (FOWLP) and Embedded technology, synchronization attention.