This year "International VLSI Technology Symposium" (VLSI), will debut on April 27th, domestic and foreign manufacturers, MediaTek, TSMC, UMC, Mentor (Mentor), IBM, ARM, Applied Materials etc., will gather together to discuss the latest international Hsinchu semiconductor device and process, design and application of chip design and system integration trend expected for hot Things (IoT) will be the focus of public attention. Organizers ITRI said smart city, smart home, car and other things related to the field of networking, will drive the next wave of growth momentum consumer electronics and semiconductor industry. As demand and application of intelligent electronic products continued rapid leap development, chip design and process technology needs with the times, for things related technology industries, foundry, non-volatile memory, such as the development of the current situation and future trends This year is also the focus of the seminar.Seminar will have two semiconductor manufacturing process and design-related joint agenda (JointSession), including TSMC, UMC, MediaTek, ARM, GLOBALFOUNDRIES and many other domestic and foreign experts for the development,application, and development challenges of the industry forward-looking technology, keynote speech.ITRI and said that this year a total of three games agenda also arranged six masterful speech, for the first time invited to the PhD, president and CEO of Mentor WaldenC.Rhines to "Towards the Internet of Things era of cost challenges" in the title to speak; Rui Dr. TadaakiYamauchi Sa core technology division general manager will then issued a "social intelligence embedded in the non-volatile memory Prospects" speech; Semiconductor Technology Officer Dr. HansStork focus on "Power and sensing how to apply car semiconductor device "theme; Ericsson Group Dr. CarlEngblom from systems integration point of view to discuss the future drive 2.5D / 3D wafer growth prospects and challenges when analyzing the advantages and disadvantages; Harvard professor DavidM.Brooks will share the circuit and system design UAV. |
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