Timing is about to enter 2012, the semiconductor industry technology continues to change, which 3DIC is the trend of the chip develops towards later,which will enable the supply chain to accelerate R & D investment of 3DIC, Intel thinks the process technology is into 3D which is bound to stimulate its own the process innovation. Also the semiconductor industry expects 3DIC has the opportunity to appear case of mass production in 2013,it is estimated in 2013 can also be seen as the first year of production for 3DIC.3DIC chip is development trend in the future, the new architecture brought about great change, Intel thinks the process technology is into 3D, the future is bound to stimulate technological innovation. Intel laboratory has recently announced co-develop 3DIC structure possessed low power consumption of memory technology with ITRI this technology will be used in future Ultrabook, tablet computers, smart phones and other mobile devices, as well as mega-million (Exascale) with large cloud data center (CloudMega-DataCenters).ITRI believes that Intel has a number of technology patents, combined with R & D base from ITRI 3DIC ,it should make the key independent technology industry in Taiwan to further promote the development of related industrial chain.