According to reports from foreign media, the chip makers, IBM, Samsung and GlobalFoundries will jointly organize Common Platform Technology Forum of 2012 on Mar 14th in the Santa Clara Convention Center in California, USA ,to show the next generation of semiconductor technology.At present, IBM, Samsung and GlobalFoundries, form the world's largest chip manufacturing alliance. The three companies will demonstrate its semiconductor innovation projects, and discuss the important topic of the 28nm, 20nm and 14nm processes. These techniques are researched and developed by common platform, mainly used in mobile phones and consumer electronic products.The general manager of IBM Microelectronics Division,Michael Cadigan said "Common Platform alliance is built on the base of unique heritage of invention and full R & D,the professionals of the company are pushing forward technological innovation and technological breakthroughs in semiconductor production.Our ecosystem is extensive and open, focusing on manufacturing capabilities, allows our customers to promote a large number of semiconductor products to the market. "Industry professionals, senior management and technical staff of the Common Platform partners will make keynote speech in the current Common Platform Technology Forum. The Forum will be about technical cooperation, the breadth of the ecosystem and the richness and partnerships propulsion. |
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IBM And Samsung Set Up The world's Largest Chip Manufacturin