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3D IC Process Standards Should Be With International Standar

Recently,Richard A.Allen,from Semiconductor Manufacturing Alliance's (SEMATECH) 3DEnablementCenter and the Senior Associate of SEMI ,James Amano shared a number of SEMI International Standards development, success stories, as well as of international technical standards in 3DIC.SEMI pointed out due to the high integration, small size, low cost and power advantages, 3DIC has become indispensable to today's semiconductor industry development of technology. SEMI Taiwan assembled a number of related businesses, and actively participate in the formulation of international standards of industrial technology, on-going discussions and Drafting of the standard required in the different stages of production, through the build of the patent, to master the international standard pulse is the best strategy of Taiwan manufacturers to create competitive advantage,  to meet the industry status quo.SEMI pointed out, due to much higher complexity of 3DIC than the traditional chip design,  technical and cost challenges follow,SEMI is oriented manufacturing,the 3DIC industry technical standards will improve productivity, reduce manufacturing costs, shorten time to market to ensure compatibility of equipment and processes all over the world.
 

    
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