Until the second half of 2015, Taiwan Semiconductor Manufacturing Company (TSMC) may still be unable to provide production-FinFET technology for ARM processor, but CEO of ARM, Warren East said he did not worry about Intel is leading to the other all factories in the technical aspects of the process. In FinFET technology, the transistor is perpendicular to the wafer surface, this method is thought to improve transistor performance and reduce the leakage current in the off state. Intel has been used 22nmFinFETCMOS process for mass production, at the same time, TSMC is trying to improve its flat 28-nmCMOS capacity for customers.However, Ease said to "EETimes", ARM and TSMC are leading Intel in SoC technology. "We are very concerned about the integration of SoC . Intel is using 32nmhigh-k metal gate planar CMOS for production. while TSMC uses 28nmhigh-k metal gate, this is not a major technology leader .However, it is true that TSMC is a leading provider in this regard. "East said Intel's 22nmFinFET is mainly used for mass production of computer chips, but the technology used in the SoC contains a large number of peripheral circuits which is not an easy thing to do.Intel currently has the Atom-based32nmMedfield processor used for smart phones and tablet PCs. Intel is also expected in 2013 they will use 22nmFinFETCMOS process to produce Atom low power processor with Silvermont architecture. Merrifield is likely to be the first to use 22nmFinFET technology for high-end smartphone processor.