According to foreign media's reports, Intel launched a new system-on-chip integration of 3G power amplifiers, a step forward in mobile computing strategy. The system chip is mainly for the entry-level mobile phones and M2M (Machine to Machine) market. The executives of Intel said that this new system-on-chip will bring 3G capabilities for phone , to reduce costs and make mobile development easier.The Intel's SMARTiEU2p system chip integrated 3G power amplifiers, and Intel's 3G High Speed ​​Packet Access (HSPA) radio frequency transponder SMARTiEU2 in a 65-nanometer chip.Intel executives said that such a system chip is smaller than a similar system chip, to reduce complexity for the developer and lower total cost of ownership of the entry-level mobile phones and M2M system. Stefan Wolff , vice president of Intel Architecture Group, said that such a system chip will simplify product development and reduce the production of products by the number of components. He said in a statement, which will allow our customers to the introduction of low-priced 3G handsets M3M markets and supports 3G connectivity devices transition to help achieve the Internet of Things. Intel's executives expect such a system chip samples will be available to selected customers in the fourth quarter. Intel will continue to work with the power amplifier manufacturers to manufacture a similar solution for smart phones and tablet PCs.