The ASML HoldingNV announced TSMC has joined its customers to invest in innovation projects who will invest 276 million euros within the next five years to the development of extreme ultraviolet (EUV) technology and 450mm lithography tool, they will invest 838 million euros to achieve 5% stake of ASML .Prior to the continuation of the ASML and TSMC 193 micron infiltration of the successful experience of lithography, and they hope to continue to work to leading the industry to develop the next generation of critical lithography, this cooperation is a natural extension of the long-term partnership between ASML and TSMC. TSMC's Executive Vice President and Co-Chief Operating Officer, Jiangshang Yi said: "one of the challenges to shrink integrated circuits size (ICscaling,) is how to effectively control escalating the cost of wafer fabrication. We believe that to inject the ASML R & D expenditures and accelerate the development of EUV lithography, but also can improve the performance of both optical lithography tools to promote the rapid development of 450mm wafer manufacturing technology,this effort will help the semiconductor industry to control the wafer costs, to protect Moore's Law continued evolution of the economic benefits. "ASML's CEO, Eric Meurice said: "Welcome to TSMC to join the" customer co-investment project ", its purpose is to make the critical lithography develop smoothly and these technologies will allow us our investment partner and entire semiconductor industry to benefit.