Under continuous growth of the printed circuit board (PCB) industry, copper industry also develops toward the multi-layer electrolytic copper foil, its main purpose is copper clad laminate manufacturers produce copper foil substrate to supply the PCB factory, and laminated multilayer outer layer PCB factory. Early copper foil market is concentrated in Europe and the United States and Japan, since 2000, the PCB industry moved to Asia, thus, copper foil plant was built in Asia, Europe and the United States copper foil plant was gradually shut down, currently only 1,900 tons per month, accounting for only 5% of global; it is 3,550 tons per month for Japan, accounting for about 10 percent, others concentrated in South Korea, Taiwan, Malaysia and mainland China together account for 85%. As the electronic products are light and thin, portable, flexible development , copper is bound to be improved, thin copper foil must be for development trends in the future . |
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The Electrolytic Copper Foil Is Development Trend Of PCB Ind