PCB is mainly used in electronic products, electronic products as the rapid development of the terminal, but also led to the development of PCB, China has become the manufacturing power electronic products as the iPhone substrate largest supplier in 2013, Shenzhen Shennan Circuits integrated in show circuit to show users its latest PCB board and board and other products that do a closed show.Shennan Circuit Co., Ltd. R & D management project manager, Jiang Jing told reporters, now for the PCB substrate, the thin and light as the consumer electronics development, will demand is also growing thin substrate, which substrate is particularly the domestic PCB manufacturers is a big challenge, how to use a thin dielectric layer made products, while mass production, and the ability to control the yield, so as to really get it on the market, competitive force. And China is now doing very few substrate factory in Shenzhen production circuit can now be done 40 microns thickness of the dielectric layer substrate in the industry in a relatively leading position.In the material, due to the basic materials required for production of PCB rests in countries such as Japan, South Korea, which also seriously hindered the development of domestic PCB manufacturers, but Jiang Jing also said that the current domestic also do some major projects, on a substrate, Construction sheet packaging material aspects even doing support, I hope to catch up with the foreign national enterprises pace and avoid being manipulated by others.PCB industry, intense competition is a long time, some corporate profits are gone still insist on continuing to do, the purpose is to keep the market for such a situation, Jiang Jing, said Shennan in this regard would be difficult to choose the higher, higher value-added products, do some market segments, the only way companies can survive a little better, if only Qupin price, first to do so will be tired, and then one for the entire industry, technological capabilities, nor possible to get a good upgrade. Jiang Jing also said: "In the first quarter of 2013, PCB industry's overall form is not very good, there is an increase in the second quarter, estimated third and fourth quarter will be relatively large increase in amplitude. Currently we are more optimistic about the intelligent terminal, in this aspects will have needs just Shennan substrates this together, but also serve the consumer electronics, intelligent terminals, so that is quite promising and we have only one plant last year, another plant is also put into operation this year, the output value of the substrate expectations compared with last year hope to have greatly improved. "In 2012, Shennan Circuit output value reached 27 billion yuan, which accounted for the bulk of the PCB substrate only to about 10%, and in this year, the output value of Shennan Circuit hope substrate can be raised to 20%. Meanwhile, Shennan Circuit is also actively developing 3DPCB field, through the chip is embedded in the substrate or device, to achieve a highly integrated products to meet the needs of the whole product more.